Ibhodi lesifunda eliprintiwe: incazelo, injongo

Ibhodi lesifunda eliphrintiwe liyisakhiwo esakhiwe esakhiweni se-dielectric kanye nabaqhubi bezethusi esetshenziselwa i-substrate ngendlela yezizinda zensimbi. Inikeza uxhumano lwazo zonke izici zesifunda se-elektroniki.

Ibhodi lesifunda eliphrintiwe linamathuba amaningi uma kuqhathaniswa ne-volumetric (hinged) ukukhuphuka usebenzisa izintambo nezintambo:

• Ukuphakama okukhulu kokufakwa kwezingxenye zomsakazo kanye nokuxhumana kwabo, okuholela ekunciphiseni okukhulu ekulinganiseni nobukhulu bomkhiqizo;
• Ukuthola abaqhubi kanye nezindawo zokuvikela, kanye nemisakazo emjikelezweni owodwa wezobuchwepheshe;
• Ukuzinza, ukuphindaphinda kwezici ezinjengekhono, ukuqhuba, ukulimaza;
• Isivinini esiphezulu nomsindo wokuzivikela wezifunda;
• Ukumelana nemithonya yemishini neyezulu;
• Ukumiswa nokuhlanganiswa kwezixazululo zobuchwepheshe nezakhayo;
• Ukuthembeka kwamayunithi, amayunithi kanye nedivayisi yonke;
• Ukwenyuka okuqhubekayo ngenxa yokuzenzekela okunamandla kwemisebenzi yomhlangano kanye nemisebenzi yokulawula nokulawula;
• Ukusebenza okuphansi kakhulu, ukusetshenziswa kwempahla kanye nezindleko.

Ibhodi yesifunda nayo inezinselelo, kodwa kunambalwa kakhulu kubo: ukugcinwa okulinganiselwe kanye nokuyinkimbinkimbi ephezulu yokwengeza izinguquko zokuklama.

Izinto ezinjalo zamabhodi zihlanganisa: isisekelo se-dielectric, i-coated metal, okuyisithombe sabaqhubi abanyathelisiwe, amathrekhi othintekayo; Ukulungisa nokumboza izimbobo.

Izidingo, okwenza kule mikhiqizo i-GOST

• Amapulangwe aphrintiwe kumele abe nomfaniswano kumbala we-dielectric umbala, okumele ube yi-monolithic esakhiweni, awuqukethe ama-bubbles angaphakathi, ama-shells, ukungena kwamanye amazwe, ukuchohloka, amacwecwe, kanye nokucubungula. Kodwa-ke, ukukhipha okukodwa, ukushaywa kwensimbi, ukulandelwa kokukodwa kwesakhiwo esingasetshenziswanga, kanye nokubonakaliswa kwesakhiwo esingashintshi imingcele kagesi yomkhiqizo, akuvumelekile ukunciphisa ibanga elivumelekile phakathi kwezakhi zaso.
• Lesi sibalo sicacile, sinomphetho ngisho nangaphandle, ngaphandle kwamabhanti, izinyembezi, izinsimbi, amamaki amathuluzi. Ama-mordants asendaweni engavumelekile avumelekile, kodwa angaphasi amaphuzu amahlanu nge-decimeter yesigcawu, uma nje wonke ububanzi bomzila buzohambisana nalokho okuvunyelwe okungenani; Ukukhwabanisa kuya kumamitha ayisithupha nokujula kwama-microns angu-25.

Ukuze uthuthukise izici zokuguquka futhi ukwandise i-solderability, ubuso bhodi buhlanganiswe nokubunjwa kwe-electrolytic, okumele kuqhubeke, ngaphandle kweminyango, izinyembezi kanye nezinsalela. Ukulungiswa nokumboza izimbobo kufanele kufakwe ngokuhambisana nomdwebo. Ivunyelwe ukuba neziphambeko ezinqunywe yisigaba sokunemba ebhodini. Ukuze kuthuthukiswe ukwethenjelwa kwe-solder kuzo zonke izindawo zangaphakathi zezimbobo ezikhulayo, uhlaka lwesethusi lufakwe, ubukhulu obufanele okungenani bungamamitha ayi-25. Le nqubo ibizwa ngokuthi - i-metallization yezimbobo.

Yiziphi izigaba ze-PCB? Leli gama lisho amakilasi wokunemba kokukhiqizwa kwebhodi, anikezwa ku-GOST 23751-86. Ngokuya ngobuningi besithombe, i-PCB inezigaba ezinhlanu zokunemba, okukhethwa kukho okubekwe yizinga lemishini yobuchwepheshe yebhizinisi. Izigaba zokuqala nezesibili azidingi imishini ecacile futhi zibhekwa njengezishibhile ekukhiqizeni. Amakilasi wesine nesesihlanu adinga izinto ezikhethekile, imishini ekhethekile, ukuhlanzeka okuhle ezindaweni zokukhiqiza, umoya wokushisa umoya, ukugcina umbuso wokushisa. Amabhizinisi asekhaya angenisa izicathulo zesifunda eziphrintiwe zesigaba sesithathu sokunemba.